Guoxing Optoelectronics "LED multi-chip integrated light source module" was recognized as a key new product in Guangdong Province

Recently, Guoxing Optoelectronics' "LED Multi-chip Integrated Light Source Module" was selected as the "Guangdong Key New Product" catalogue. This product adopts the embedded metal heat sink high thermal conductivity substrate and multi-lamination thermoelectric separation package substrate manufacturing technology, combined with the planar array lens packaging process, with independent intellectual property rights.

Compared with similar products at home and abroad (PPA plus metal substrate bracket light source module, aluminum substrate light source module, etc.), this product has lower thermal resistance, higher luminous efficiency, higher color rendering index, and great competition in product price. Advantage. 1 and FIG. 2 are LED multi-chip integrated light source modules manufactured based on an embedded metal heat sink high thermal conductive substrate and a multi-laminate hot spot separation package substrate, respectively.

Guoxing Optoelectronics has invested a lot of research and development power in multi-chip integrated LED packaging technology. The company has now realized mass production of multiple series and specifications of COB LED light source modules such as 1010, 1215, 1313, 1723, 1919, 3*3 MCOB, 4*6 MCOB, and single module power 3-100W.

Figure 1 Embedded metal heat sink high thermal conductivity substrate MCOB



Figure 2 Multi-layered package substrate COB



Figure 3 Guangdong Province Key New Product Certificate

(This article is based on Guoxing Optoelectronics submission)


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