Hangzhou Bay Photoelectric Industrial Park

Hangzhou Bay Photoelectric Industrial Park is an emerging industrial park planned by the development zone in the process of attracting investment in recent years. It is planned to be built in the new area of ​​the bridge. The total planned area is about 1000 mu, and the total investment is expected to exceed 3 billion yuan. It is planned to make it the eighth largest base after the three-year and five-year national semiconductor lighting engineering industrialization base approved by the Ministry of Science and Technology and approved by the Ministry of Science and Technology. According to the spatial layout conditions of the industrial park and the relationship between the upstream and downstream of the industrial chain of the LED industry, the industrial park will scientifically layout the entire optoelectronic industrial park with the overall spatial structure of “one park and four districts”:

“One Park” is an upstream industrial sector mainly based on epitaxial wafer production and chip production, and a downstream industrial sector mainly based on packaging and application. It is an ecological, efficient and orderly semiconductor. The Lighting Industry Park is the core area of ​​the future high-tech industry in the New Bridge Area.

The "four zones" are an epitaxial patch area, a chip area, a package area, and an application area, respectively.

Epitaxial area: The planned land area is about 120 mu, which is mainly based on LED R&D and epitaxial film production. It is the engine area of ​​LED Industrial Park.

Chip area: The planned land area is about 210 mu. It is mainly used to produce GAN chips and high-power chips. At the same time, it develops supporting industries such as LED package brackets, which is the core area of ​​LED industry park.

Packaging area: The planned land area is about 120 mu, which is mainly based on chip packaging. It will focus on the development of packaging industry such as Lamp packaging, SMD packaging and high power packaging.

Application area: The planned land area is about 450 mu, focusing on the development of LED display, automobile lighting, traffic signal lights, chromatic lighting, safety lighting and other special lighting.

In order to promote the development of the industrial park in an orderly manner, the development zone will set up an integrated service center, an LED industry R&D center, a chip testing center and an application testing center on the nodes associated with the four districts. Among them, the integrated service center will provide administrative services such as administrative office, product display and business activities for the entire LED industrial park. The LED Industry R&D Center will provide innovative activities for technology upgrades, product updates, and new product development for the LED industry in the New Area. The chip inspection center will provide testing for the chip to ensure the production quality of the chip and the overall pass rate of the product. The Application Testing Center will provide testing services for LED application manufacturers.