Passive packaging for circuit assembly technology

With the demand for miniaturization, high performance, high reliability, safety and electromagnetic compatibility of electronic equipment in the industrial and consumer electronics markets, new demands are placed on the performance of electronic circuits, since the 1990s, The components are further developed in the direction of miniaturization, multi-layering, large capacity, high voltage resistance and high performance. At the same time, with the popularization and application of SMT in all electronic devices, the use of chip components worldwide has increased rapidly. The number of components reaches 1 megabit, and the ratio of passive components to IC is generally greater than 20. Since such a large number of discrete components are required, the discrete components dominate the size of the final PCB component; in addition, the increase in the amount of chip passive components enables placement. The bottleneck in the process is more difficult to solve by the placement of chip components, resulting in a loss of balance in the production line, a decrease in equipment utilization rate, and an increase in cost. At the same time, the supply time of the chip components occupies 30% of the production line time, which seriously affects the increase in production volume. An effective way to solve these problems is. Achieve the integration of passive components.
The integrated passive components are available in the following packages:
Array: integrates many types of passive components together and encapsulates them in the form of planar array terminals;
Network: integrates many hybrid resistors and capacitors and encapsulates them in the form of peripheral terminals;
Hybrid: a mixture of some passive components and active devices for packaging;
Embedding: embedding passive components in a PCB or other substrate;
Integrated Hybrid: The integrated passive components are packaged in QFP or TSOP format.
The popularization and application of these passive packages can effectively solve the placement: bottleneck, improve the balance of SMT production line, reduce the cost, increase the output, and increase the assembly density.
The development of advanced board-level circuit assembly technology is largely restricted by the assembly process. Without advanced assembly technology, advanced packaging is difficult to promote and apply. Therefore, the emergence of advanced packaging will inevitably lead to assembly process. New requirements. In general, BGA, CSP, and MCM can be assembled using standard surface mount equipment processes. However, due to the miniaturization of the package terminal surface array, stricter requirements are imposed on the assembly process, thereby facilitating SMT assembly equipment and processes. development of.